Biomaterials as bonding wires for integrated circuit nanopackaging
Weigel-Jech, M. and Bartenwerfer, M. and Mikczinski, M. and Fatikow, S.
IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM) 2011
01 / 2011
978-1-4577-0838-1
inproceedings
IEEE
385-390
