Approach for the 3D-Alignment in Micro- and Nano-scale Assembly Processes

BIB
Wich, T. and Stolle, C. and Mikczinski, M. and Fatikow, S.
IFIP Advances in Information and Communication Technology
01 / 2010
978-3-642-11597-4
incollection
Springer Berlin Heidelberg
167-173