The latest generation of electronic devices--integrated circuits or discrete components--is often required to operate in harsh environmental conditions.; for example in situations where temperatures may reach over 100 degrees Celsius (212 degrees F) . Obviously, high temperatures can have negative impacts on the electronic devices. These can range from slow-down and transient (recoverable) errors to permanent failures and device breakdown. To further complicate the picture, electronic components tend to get warmer on their own as they operate, due to the fact that the power drawn by the devices from the power supply is dissipated by the Joule effect.
As time passes, heat and temperature management is becoming increasingly problematic; for reasons ranging from economical to technological. Packages that are able to sustain high temperatures are very expensive, and so are heat-sinks and cooling systems. In addition, high operating temperatures tend to cause malfunctioning of circuits and components and to shorten their lifetimes, thus impacting the reliability of the electronic products which incorporate such devices. The development of a new, thermal-aware design platform can no longer be postponed if the goal is to enable designers to fully exploit the semiconductor technologies of the future, regardless if these are CMOS or CMOS alternatives. At the core of this new design platform lies an early but promising thermal estimation which allows the designer to optimize design in terms of the expected temperature behavior of the finished product.
07 / 2012
Modeling, Control and Management of Thermal Effects in Electronic Circuits of the Future